DI-PIP™ Amine (1,3-Di-4-Piperidylpropane) is used as a component of polyamide hot melt or custom blend adhesives.
Due to their high heat and chemical resistance properties, polyamide-based hot melt adhesives are generally used in electronics, automotive, and aerospace applications.
Adhesive for Automotive Interiors
Automotive interiors present a challenging environment due to extreme temperatures, high stress, and diverse materials. DI-PIP Amine imparts strong, flexible bonds to the adhesive system that keeps automotive interiors attractive and functional through years of hard use.
Adhesive for Electronics
DI-PIP Amine can be used in precision hot melt adhesive systems, and is applied robotically, to assemble electronic components or complete devices such as tablets and phones. It also finds use to encapsulate exposed electronics to provide weather protection for applications like outdoor LED lighting.
DI-PIP Amine helps screws and bolts stay in place through its role in thread lock coatings. The fastener is dipped in thread locker, which is heat activated by the friction of the turning screw, keeping it in place after activation. Thermal stability and excellent chemical and grease resistance are among the robust properties that suit DI-PIP Amine to thread locking applications.
Melt Point (°C)
Values shown in the above table are typical properties.
Automotive Interior Adhesive
Can handle high stress in demanding conditions
Hot Melt Adhesive for Electronics
Helps bond both porous and nonporous surfaces
Hot Melt Adhesive
Used as a component of hot melt adhesives
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