Di-Pyr in CASE Applications

Di-Pyr (1,3-Di-4-Pyridylpropane) finds use in the CASE (Coatings, Adhesives, Sealants, and Elastomers) applications.

Applications

Adhesives and Sealants

The known applications are in automotive interiors and electronics. Imparts ultra adhesive properties for high heat, high tensile environemnts. high heat, high stress environments were you are bonding together different materials. 

Adhesive for Electronics

The known applications are in automotive interiors and electronics. Imparts ultra adhesive properties for high heat, high tensile environemnts. high heat, high stress environments were you are bonding together different materials. 

 

Helps bond both porous and nonporous surfaces in advanced manufacturing. 

Features

Features

Typical Properties

Solution
Acid Value
Hydroxyl Value
Saponification Value
Iodine Value
Melt Point (°C)
Specific Gravity
Castorwax
3
158
179
5
85
1.023

Values shown in the above table are typical properties.

Application Highlights

Sealants

Can handle high stress in demanding conditions

Hot Melt Adhesive for Electronics

Helps bond both porous and nonporous surfaces

Hot Melt Adhesive

Used as a component of hot melt adhesives

Additional Resources

Available upon request. Please use the Contact Us form. 

Available upon request. Please use the Contact Us form. 

  • Not Applicable

Features

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